Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,746
In-stock
Comair Rotron HEATSINK STAMP 19.4X25.4X11.4MM - Obsolete Copper Board Level Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 1.5W @ 20°C 4.00°C/W @ 200 LFM - Tin
V-1102-SMD/A-L
RFQ
VIEW
RFQ
3,242
In-stock
Assmann WSW Components HEATSINK TO-263 19.38X25.40MM - Active Copper Top Mount Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) - - 23.00°C/W Tin
7109DG
RFQ
VIEW
RFQ
872
In-stock
Aavid, Thermal Division of Boyd Corporation TOP MOUNT HEATSINK .45" D2PAK - Active Copper Top Mount Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Tin
7109D/TRG
RFQ
VIEW
RFQ
3,327
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 - Active Copper Top Mount Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Tin
7109D/TRG
RFQ
VIEW
RFQ
2,594
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 - Active Copper Top Mount Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Tin
7109D/TRG
RFQ
VIEW
RFQ
3,374
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 - Active Copper Top Mount Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) TO-263 (D²Pak) SMD Pad 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Tin