Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
BDN12-5CB/A01
RFQ
VIEW
RFQ
3,389
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.21"SQ BDN Active Aluminum Top Mount Square, Pin Fins 1.210" (30.73mm) 1.210" (30.73mm) Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.555" (14.10mm) - 5.20°C/W @ 400 LFM 16.50°C/W Black Anodized
BDN12-3CB/A01
RFQ
VIEW
RFQ
995
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.21"SQ BDN Active Aluminum Top Mount Square, Pin Fins 1.210" (30.73mm) 1.210" (30.73mm) Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 6.80°C/W @ 400 LFM 19.60°C/W Black Anodized
6022BG
RFQ
VIEW
RFQ
3,701
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 STAGGERED FIN - Active Aluminum Board Level, Vertical Rectangular, Fins 1.210" (30.73mm) 0.875" (22.22mm) TO-220 Bolt On and PC Pin 0.250" (6.35mm) 2.0W @ 40°C 6.00°C/W @ 400 LFM 16.70°C/W Black Anodized