- Series :
-
- 100 (4)
- 410 (1)
- 500 (1)
- 501 (5)
- 503 (12)
- 508 (20)
- 510 (1)
- 511 (4)
- 518 (29)
- 612 (4)
- 614 (8)
- 6621 (1)
- 700 Elevator Strip-Line™ (1)
- 714 (1)
- 8 (39)
- 800 (1)
- Correct-A-Chip® 1109800 (1)
- D0 (2)
- D39 (1)
- Edge-Grip™, C81 (1)
- Edge-Grip™, C91 (1)
- ICA (1)
- ICO (1)
- Lo-PRO®file, 513 (15)
- OEM (1)
- Textool™ (2)
- Vertisockets™ 800 (25)
- XR2 (3)
- Part Status :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (10)
- DIP, 0.3" (7.62mm) Row Spacing (115)
- DIP, 0.4" (10.16mm) Row Spacing (19)
- DIP, 0.6" (15.24mm) Row Spacing (27)
- DIP, 0.9" (22.86mm) Row Spacing (9)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (1)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (1)
- SIP (2)
- SOIC (1)
- Zig-Zag, Left Stackable (1)
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (23)
- Polyamide (PA46), Nylon 4/6, Glass Filled (132)
- Polybutylene Terephthalate (PBT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (12)
- Polyester (2)
- Polyester, Glass Filled (2)
- Polyether Imide (PEI), Glass Filled (1)
- Polyethersulfone (PES), Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Polysulfone (PSU), Glass Filled (1)
- Thermoplastic, Polyester (1)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
187 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
806
In-stock
|
3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 20 (2 x 10) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
|
VIEW |
3,167
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,887
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,019
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
2,281
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
664
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,154
In-stock
|
3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
747
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,958
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
2,293
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,276
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,268
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,305
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,230
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
988
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,519
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,066
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,288
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,321
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,573
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,032
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,975
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,024
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,670
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,205
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
752
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,703
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
2,139
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
