Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,906
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Amphenol FCI CONN SOCKET SIP 18POS GOLD SIP050-1x Obsolete Bulk Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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1,183
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Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,058
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Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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802
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Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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2,514
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Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,429
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Aries Electronics CONN SOCKET SIP 18POS GOLD 0517 Active Bulk Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass