- Part Status :
- Operating Temperature :
- Termination :
- Housing Material :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Finish Thickness - Post :
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125 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
876
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,019
In-stock
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3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,281
In-stock
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3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
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VIEW |
664
In-stock
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3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
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VIEW |
3,154
In-stock
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3M | CONN IC DIP SOCKET 20POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 20 (2 x 10) | Beryllium Copper | Flash | Brass | |||
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VIEW |
747
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,276
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,268
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,305
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,230
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,519
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,066
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,288
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,321
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,670
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,205
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,139
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,847
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 20 (2 x 10) | Brass | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,775
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,581
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,573
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
672
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,859
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,807
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,718
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,953
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,004
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,002
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,412
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,557
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass |