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92 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,703
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 36POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
3,308
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,518
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,840
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 36POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
3,095
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,804
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,831
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,580
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,116
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,747
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,572
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,808
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,169
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,316
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,790
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
2,379
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,558
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
1,730
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
1,330
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
1,370
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,233
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,398
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,720
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
781
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
694
In-stock
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Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,424
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
2,317
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
1,696
In-stock
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Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
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VIEW |
2,473
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,160
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 36POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 36 (2 x 18) | Beryllium Copper | - | Brass | |||
