Sockets for ICs, Transistors Products For Sale - PDF

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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post
GLOBAL STOCKS
	D01-9933201	RFQ VIEW	PDF RFQ	1,269 In-stock	Harwin Inc.	CONNECTOR	D01-993	Obsolete	Bulk	-55°C ~ 125°C	Through Hole	Solder Cup	-	SIP	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	-	Tin	32 (1 x 32)	Brass	-
	0009483031	RFQ VIEW	PDF RFQ	2,439 In-stock	Molex, LLC	CONN SOCKET TRANSIST TO-220 3POS	-	Obsolete	Bulk	-40°C ~ 80°C	Through Hole	Solder	Closed Frame	Transistor, TO-220	Polyamide (PA66), Nylon 6/6	-	Tin	100.0µin (2.54µm)	Tin	3 (Rectangular)	Brass	100.0µin (2.54µm)
	550-10-652M35-001152	RFQ VIEW	PDF RFQ	3,438 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	652 (35 x 35)	Brass	10.0µin (0.25µm)
	550-10-560M33-001152	RFQ VIEW	PDF RFQ	604 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	560 (33 x 33)	Brass	10.0µin (0.25µm)
	550-10-600M35-001152	RFQ VIEW	PDF RFQ	1,316 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	600 (35 x 35)	Brass	10.0µin (0.25µm)
	550-10-576M30-001152	RFQ VIEW	PDF RFQ	706 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	576 (30 x 30)	Brass	10.0µin (0.25µm)
	550-10-520M31-001152	RFQ VIEW	PDF RFQ	3,322 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	520 (31 x 31)	Brass	10.0µin (0.25µm)
	550-10-504M29-001152	RFQ VIEW	PDF RFQ	1,714 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	504 (29 x 29)	Brass	10.0µin (0.25µm)
	550-10-500M30-001152	RFQ VIEW	PDF RFQ	1,951 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	500 (30 x 30)	Brass	10.0µin (0.25µm)
	550-10-480M29-001152	RFQ VIEW	PDF RFQ	2,124 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	480 (29 x 29)	Brass	10.0µin (0.25µm)
	550-10-478M26-131152	RFQ VIEW	PDF RFQ	3,692 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Open Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	478 (26 x 26)	Brass	10.0µin (0.25µm)
	550-10-456M26-001152	RFQ VIEW	PDF RFQ	2,185 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	456 (26 x 26)	Brass	10.0µin (0.25µm)
	550-10-432M31-001152	RFQ VIEW	PDF RFQ	765 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	432 (31 x 31)	Brass	10.0µin (0.25µm)
	550-10-420M26-001152	RFQ VIEW	PDF RFQ	1,703 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	420 (26 x 26)	Brass	10.0µin (0.25µm)
	550-10-400M20-000152	RFQ VIEW	PDF RFQ	3,086 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	400 (20 x 20)	Brass	10.0µin (0.25µm)
	550-10-192M16-001152	RFQ VIEW	PDF RFQ	3,784 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	192 (16 x 16)	Brass	10.0µin (0.25µm)
	550-10-256M20-001152	RFQ VIEW	PDF RFQ	2,285 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	256 (20 x 20)	Brass	10.0µin (0.25µm)
	550-10-256M16-000152	RFQ VIEW	PDF RFQ	2,768 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	256 (16 x 16)	Brass	10.0µin (0.25µm)
	550-10-255M16-001152	RFQ VIEW	PDF RFQ	3,950 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	255 (16 x 16)	Brass	10.0µin (0.25µm)
	1109681-628 100 PCS MINIMUM	RFQ VIEW	PDF RFQ	3,492 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	-	Active	Bulk	-	Through Hole	Solder	Spacer	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin-Lead	28 (2 x 14)	Brass	200.0µin (5.08µm)
	1109681-648 100 PCS MINIMUM	RFQ VIEW	PDF RFQ	2,738 In-stock	Aries Electronics	CONN IC DIP SOCKET 48POS GOLD	-	Active	Bulk	-	Through Hole	Solder	Spacer	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin-Lead	48 (2 x 24)	Brass	200.0µin (5.08µm)
	1109681-632 100 PCS MINIMUM	RFQ VIEW	PDF RFQ	1,359 In-stock	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	-	Active	Bulk	-	Through Hole	Solder	Spacer	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin-Lead	32 (2 x 16)	Brass	200.0µin (5.08µm)
	1109681-624 100 PCS MINIMUM	RFQ VIEW	PDF RFQ	1,282 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD	-	Active	Bulk	-	Through Hole	Solder	Spacer	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin-Lead	24 (2 x 12)	Brass	200.0µin (5.08µm)
	1109681-324 100 PCS MINIMUM	RFQ VIEW	PDF RFQ	720 In-stock	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD	-	Active	Bulk	-	Through Hole	Solder	Spacer	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin-Lead	24 (2 x 12)	Brass	200.0µin (5.08µm)
	1109681-328 100 PCS MINIMUM	RFQ VIEW	PDF RFQ	1,850 In-stock	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	-	Active	Bulk	-	Through Hole	Solder	Spacer	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin-Lead	28 (2 x 14)	Brass	200.0µin (5.08µm)
	550-10-388M26-001152	RFQ VIEW	PDF RFQ	3,689 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	388 (26 x 26)	Brass	10.0µin (0.25µm)
	550-10-360M19-001152	RFQ VIEW	PDF RFQ	2,631 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	360 (19 x 19)	Brass	10.0µin (0.25µm)
	550-10-357M19-001152	RFQ VIEW	PDF RFQ	3,271 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	357 (19 x 19)	Brass	10.0µin (0.25µm)
	550-10-356M26-001152	RFQ VIEW	PDF RFQ	3,733 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	356 (26 x 26)	Brass	10.0µin (0.25µm)
	550-10-352M26-001152	RFQ VIEW	PDF RFQ	1,565 In-stock	Preci-Dip	BGA SOLDER TAIL	550	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	BGA	FR4 Epoxy Glass	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Gold	352 (26 x 26)	Brass	10.0µin (0.25µm)

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