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27 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
656
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
2,453
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,031
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,401
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,478
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,577
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
1,585
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
2,427
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,526
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,071
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
1,427
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
1,952
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
2,982
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,445
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
1,444
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,380
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
2,780
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,420
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
967
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,697
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,726
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,152
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,630
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
3,713
In-stock
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Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,526
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
VIEW |
698
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,798
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass |