Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,137
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TE Connectivity Potter & Brumfield Relays CONN IC DIP SOCKET 32POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) 32 (2 x 16) Copper Alloy - -
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2,743
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
110-99-432-41-001000
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3,148
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-99-632-41-001000
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2,322
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
1-2199300-2
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729
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, No Center Bar DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze 60.0µin (1.52µm) Brass, Copper
110-99-632-41-001000
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3,421
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
DILB32P-223TLF
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3,070
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Amphenol FCI CONN IC DIP SOCKET 32POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Copper Alloy 100.0µin (2.54µm) Copper Alloy
214-99-632-01-670800
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2,533
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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796
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Beryllium Copper - Brass