- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (4)
- DIP, 0.3" (7.62mm) Row Spacing (12)
- DIP, 0.6" (15.24mm) Row Spacing (89)
- DIP, ZIF (ZIP) (5)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (32)
- DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing (1)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (40)
- PLCC (2)
- SOIC (2)
- Zig-Zag, Right Stackable (1)
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (6)
- Polyamide (PA46), Nylon 4/6, Glass Filled (60)
- Polybutylene Terephthalate (PBT) (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (15)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Polyester (6)
- Polyetheretherketone (PEEK), Glass Filled (7)
- Polyethersulfone (PES), Glass Filled (2)
- Polyphenylene Sulfide (PPS) (1)
- Polyphenylene Sulfide (PPS), Glass Filled (62)
- Polysulfone (PSU), Glass Filled (4)
- Thermoplastic, Glass Filled (13)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
188 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,634
In-stock
|
Molex, LLC | CONN IC DIP SOCKET 28POS TINLEAD | - | Obsolete | - | - | Through Hole | - | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 28 (2 x 14) | - | - | - | |||
|
VIEW |
2,644
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,717
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,237
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,099
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,109
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,856
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS | 500 | Obsolete | - | - | Through Hole | - | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | - | - | - | 28 (2 x 14) | - | - | - | |||
|
VIEW |
2,513
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS | 500 | Obsolete | - | - | Through Hole | - | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | - | - | - | 28 (2 x 14) | - | - | - | |||
|
VIEW |
2,825
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Obsolete | - | - | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | - | - | - | |||
|
VIEW |
2,812
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | - | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
|
VIEW |
896
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
2,473
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
1,123
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
2,963
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
3,030
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
2,819
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
3,838
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,026
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
863
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
792
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,853
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,056
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,405
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,278
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
1,744
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
876
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
3,317
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
1,860
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 28 (2 x 14) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel |