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117 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
3,837
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,145
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,870
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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VIEW |
3,609
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,231
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,757
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
3,361
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
2,009
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,704
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,219
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
677
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
1,703
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,306
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,927
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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VIEW |
2,705
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,004
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,760
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,498
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
801
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
3,759
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
747
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,101
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,541
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,770
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,273
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,427
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,670
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,924
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,018
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
