- Operating Temperature :
- Termination :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
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26 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,044
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,886
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,658
In-stock
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,237
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
800
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,639
In-stock
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3M | CONN IC DIP SOCKET 48POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 48 (2 x 24) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,207
In-stock
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3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 42 (2 x 21) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,933
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,994
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,183
In-stock
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3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
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VIEW |
3,440
In-stock
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3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
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VIEW |
1,585
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
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VIEW |
3,029
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,054
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
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VIEW |
1,985
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,864
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 40 (2 x 20) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
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VIEW |
839
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 24 (2 x 12) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
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VIEW |
3,723
In-stock
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3M | CONN IC DIP SOCKET 48POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 48 (2 x 24) | Beryllium Copper | Flash | Brass | |||
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VIEW |
655
In-stock
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3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 42 (2 x 21) | Beryllium Copper | Flash | Brass | |||
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VIEW |
785
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,023
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
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VIEW |
1,777
In-stock
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3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,087
In-stock
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3M | CONN IC DIP SOCKET 32POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 32 (2 x 16) | Beryllium Copper | Flash | Brass | |||
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VIEW |
2,687
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
1,316
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
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VIEW |
1,098
In-stock
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3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass |