Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
A32-LCG-T-R
RFQ
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RFQ
2,944
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) -
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RFQ
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RFQ
3,863
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper
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RFQ
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RFQ
3,690
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 25.0µin (0.63µm) 32 (2 x 16) Beryllium Copper
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RFQ
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RFQ
3,281
In-stock
CNC Tech CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze
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RFQ
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RFQ
2,186
In-stock
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
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RFQ
2,806
In-stock
CNC Tech CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 32 (2 x 16) Phosphor Bronze
ED32DT
RFQ
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RFQ
2,469
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 32POS TIN ED Active Tube -55°C ~ 110°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze