- Part Status :
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27 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,307
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 48POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,738
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 48 (2 x 24) | Brass | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,696
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,464
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,400
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,758
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,124
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,249
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,735
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,472
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,212
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,929
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,638
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,206
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,684
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,602
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,217
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,386
In-stock
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Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,955
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,103
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 48POS GOLD | D0 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
730
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,637
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,161
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
3,918
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,684
In-stock
|
CNC Tech | CONN IC DIP SOCKET 48POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,407
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
751
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
