Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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AR28-HZL-TT
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RFQ
2,541
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZW/T
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RFQ
2,987
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZL/07-TT
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RFQ
2,074
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
3,428
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 28 HZL/01-TT
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RFQ
2,676
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR-28-HZL/07-TT
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RFQ
2,214
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
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RFQ
3,552
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) 28 (2 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
AR 28-HZW/TN
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RFQ
2,832
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 28 HZL-TT
RFQ
VIEW
RFQ
2,519
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper