- Series :
-
- 101 (1)
- 110 (31)
- 111 (3)
- 114 (7)
- 115 (10)
- 116 (29)
- 121 (2)
- 122 (4)
- 123 (9)
- 124 (2)
- 126 (3)
- 146 (6)
- 210 (5)
- 214 (2)
- 299 (4)
- 500 (8)
- 501 (3)
- 503 (2)
- 508 (6)
- 511 (1)
- 612 (2)
- 614 (8)
- 700 (1)
- BU-178HT (1)
- D0 (1)
- D2 (1)
- D26 (1)
- D95 (1)
- Diplomate DL (14)
- Edge-Grip™, C91 (1)
- EJECT-A-DIP™ (9)
- IC (2)
- ICA (3)
- iCF (2)
- ICO (3)
- XR2 (3)
- Part Status :
- Packaging :
- Termination :
- Housing Material :
-
- Aluminum Alloy (1)
- Liquid Crystal Polymer (LCP) (2)
- Plastic (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (22)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (64)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (67)
- Polyester (4)
- Polyester, Glass Filled (7)
- Thermoplastic, Glass Filled (14)
- Thermoplastic, Polyester (1)
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
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- Applied Filters :
192 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,886
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,717
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,237
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,109
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,884
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
2,910
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,838
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,026
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,977
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,853
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,639
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,826
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,200
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
607
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,407
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
3,111
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,096
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,835
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,898
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,692
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,554
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
691
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,585
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,323
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,669
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,373
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,434
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,764
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
762
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |