- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Housing Material :
-
- - (162)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (25)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (54)
- Polyester (1)
- Polyester, Glass Filled (4)
- Polyetheretherketone (PEEK), Glass Filled (8)
- Polyphenylene Sulfide (PPS), Glass Filled (74)
- Polysulfone (PSU), Glass Filled (2)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (1)
- Contact Finish - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
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180 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
3,180
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,355
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,594
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,608
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,207
In-stock
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3M | CONN IC DIP SOCKET 42POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 42 (2 x 21) | Beryllium Copper | Flash | Brass | |||
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VIEW |
1,312
In-stock
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3M | CONN IC DIP SOCKET 42POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 42 (2 x 21) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
1,522
In-stock
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3M | CONN IC DIP SOCKET 42POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 42 (2 x 21) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
2,721
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 42POS TINLEAD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 42 (2 x 21) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
1,214
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
2,395
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
2,882
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
1,586
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
2,310
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
3,314
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
VIEW |
1,650
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,678
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,388
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,680
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,195
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
2,827
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
820
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,134
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,873
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
1,974
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
3,128
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
648
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 42 (2 x 21) | Beryllium Nickel | 50.0µin (1.27µm) | Beryllium Nickel | |||
|
VIEW |
3,239
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,024
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 42POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
3,496
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 42POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,528
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper |