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7 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
3,582
In-stock
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On Shore Technology Inc. | CONN SOCKET PLCC 28POS | ED | Active | Tube | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | PLCC | Polyphenylene Sulfide (PPS) | 0.050" (1.27mm) | - | - | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
3,905
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,399
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,538
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
824
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,782
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS TINLEAD | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
676
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |