- Part Status :
- Packaging :
- Housing Material :
-
- Aluminum Alloy (1)
- Plastic (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (52)
- Polybutylene Terephthalate (PBT) (4)
- Polybutylene Terephthalate (PBT), Glass Filled (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (49)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (51)
- Polyester (17)
- Polyester, Glass Filled (12)
- Polyphenylene Sulfide (PPS), Glass Filled (6)
- Thermoplastic (1)
- Thermoplastic, Glass Filled (21)
- Thermoplastic, Polyester (6)
- Thermoplastic, Polyester, Glass Filled (2)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
240 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,243
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 28 (2 x 14) | Copper Alloy | - | Copper Alloy | |||
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VIEW |
2,886
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,541
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,717
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
1,897
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,492
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,449
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,069
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,109
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
1,700
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 28 (2 x 14) | Copper Alloy | - | - | |||
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VIEW |
3,884
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
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VIEW |
1,749
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
2,218
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | - | - | - | 28 (2 x 14) | Copper Alloy | - | - | |||
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VIEW |
2,812
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | - | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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VIEW |
1,585
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
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VIEW |
3,029
In-stock
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3M | CONN IC DIP SOCKET 28POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 28 (2 x 14) | Beryllium Copper | Flash | Brass | |||
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VIEW |
961
In-stock
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3M | CONN IC DIP SOCKET 28POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
3,730
In-stock
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3M | CONN IC DIP SOCKET 28POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
2,910
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
3,838
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
2,964
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | - | - | - | |||
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VIEW |
2,074
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,428
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,026
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,977
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
792
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,853
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,056
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
840
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
3,922
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper |