Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
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1,455
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm)
AR32-HZL/07-TT
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2,428
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm)
AR32-HZL/01-TT
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RFQ
1,702
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm)
A32-LCG-T-R
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RFQ
2,944
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) - -
A32-LC-TR
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RFQ
697
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -55°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze -
AR 32 HZL/01-TT
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RFQ
1,578
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm)
AR32-HZL/07-TT-R
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RFQ
638
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm)
A 32-LC-TT
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RFQ
967
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -55°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze -